What’s the difference between Printed circuit board vs PCB Assembly?
PCB is a printed circuit board because it is made by electronic printing, so it is called a “printed” circuit board. PCB is an important electronic component in the electronic industry, it is electronic base. It is the support of electronic components and the carrier of electrical connection of electronic components. PCB has been widely used in the production of electronic products.

PCB Assembly generally refers to a processing flow, which can also be understood as the finished circuit board, that is, PCBA can only be counted after the processes on the PCB are completed. PCB refers to an empty printed circuit board with no parts on it. The above is the difference between PCB and PCBA.

SMT (surface mounted technology) and DIP (Dual In-line Package) are both ways to integrate parts on the circuit board. The main difference is that SMT does not need to drill holes on PCB, but in dip, it needs to insert the pin into the drilled hole.

SMT mainly uses the mounting machine to mount some micro and small parts on the circuit board. Its production process is PCB positioning, solder paste printing, mounting by the mounting machine, reflow oven, and inspection.

The dip is a “plug-in”, that is to insert parts on the PCB board. It is a kind of plug-in integrated part when some parts are large in size and not suitable for mounting technology. Its main production processes are back glue, plug-in, inspection, wave soldering, plate brushing, and finished inspection.

Flexible Volume PCB Assembly Service
Our PCB assembly services go above and beyond what the average PCB assembly company will do. We offer a variety of flexible circuit board assembly services for the different stages of your product development, including:

• Prototype PCB Assembly: See how well your PCB design works before generating a large order. Our quality prototype PCB assembly allows us to deliver a quick prototype, so you can identify any potential challenges in your design fast and optimize the quality of your final boards.
• Low-Volume, High Mix PCB Assembly: If you require a number of different boards for specialized applications, HitechPCB is your company.
• High-Volume PCB Assembly: We are equally as skilled at cranking out large PCB assembly orders as we are at delivering small ones.
• Consigned & Partial PCB Assembly: Our consigned PCB assembly services meet IPC Class 2 or IPC class 3 standards, are ISO 9001:2015-certified and are RoHS-compliant.
• Full Turnkey PCB Assembly: Also ISO 9001:2015-certified and RoHS-compliant, our turnkey PCB assembly allows us to take care of your entire project from start to finish, so you can step in and start taking advantage of the finished product right away.

From SMD to through-hole and mixed PCB assembly projects, we do it all, including free Valor DFM/DFA checks and function testing to verify the quality of your boards, with no minimum cost requirements or added tooling charges when you reorder.

Hitech Circuits integrates quality ISO certified systems and innovative assembly and packaging technologies to deliver market-leading consumer electronic products. From product assembly through enclosures to testing and packaging, Hitech’s SMT lines utilize the most advanced technologies in the industry including:

Quick turn pcb assembly Flip Chip Technologies
0201 Technology
Lead-Free Solder Technology
Alternative PCB Finishes
Early supplier involvement
Design and engineering support
PCB manufacturing and PCB assembly
Backplane assembly

Memory and optical modules
Cable and harness assembly
Plastic injection molding
Precision machining
Enclosures
Integration of hardware and software
BTO and CTO services according to your needs
Reliability testing
Lean and Six Sigma quality processes

We offer both human and automated PCB assembly services for PCBA Prototype
Our PCB assembly processes use both human and automated services. Larger PCB assembly projects can benefit from the speed and accuracy of our automated service, while PCBA prototypes more detailed work can be checked in-house by one of our expert team members.

Surface Mount Technology assembly (SMT Assembly)
At Hitech, we have capabilities to utilize surface mount technology to assemble your PCBs, using our pick and place machine. We use surface mount assembly technology as it is more cost-efficient and reliable than other, more traditional PCB assembly methods. For example, with SMT assembly more electronics can be included in a smaller space on a PCB. This means PCBs can be customised much more easily and efficiently, and at a much higher volume.

Testing and quality control
To ensure PCB assembly process is fault-free, we use innovative AOI and X-Ray testing and checking. AOI, or automated optical inspection, test PCBs for catastrophic failure and quality defects by autonomously scanning them with a camera. We use automated testing at multiple stages of our PCB assembly process to ensure all our PCBs are of the highest quality.

Our technology
At Hitech, we utilise the latest advancements in technology for our printed circuit board assembly. Just some of the tech and machines we use includes:

• Wave soldering machine
• Pick and place
• AOI & X-Ray
• Automated conformal coating
• SPI machine
If you’re interested in our products, pls kindly email to Sandy: sales9PCB Manufacturer PCB Assembly.com
https://hitechcircuits.com/pcb-assembly/

Ceramic PCB fabrication and electronics assembly

Hitech focus on one-stop electronic manufacturing services (EMS) including ceramic pcb fabrication and electronics assembly, SMT assembly, through hole soldering. All products are widely used in electronic equipment.
Technical Parameters
Product type: ALN Ceramic Substrate
Material: Aluminum Nitride Ceramic 180W/m.K
Layer/Thickness: 1L/1.5mm
Outer Copper: 1 OZ
Surface treatment: Hard gold
Solder Mask: White X 1 side
Technical featuer: special materials

Send An Inquiry
Product Name:
Ceramic PCB fabrication and electronics assembly
If you’re interested in our products, pls kindly email to Sandy: sales9PCB Manufacturer PCB Assembly.com
https://hitechcircuits.com/pro....duct/ceramic-pcb-fab

Applications of high-density interconnected PCB boards

While electronic design is constantly improving the performance of the whole equipment, researchers are also working hard to reduce its size. In small portable products ranging from mobile phones to smart weapons, “small” is an eternal pursuit. High-density interconnection (HDI PC technology can make terminal product designs more compact, while meeting higher standards of electronic performance and efficiency. HDI PCB board is widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics, IC carrier boards and other digital products, among which mobile phones are the most widely used.

High density PCB is used extensively in applications and industries including

Cell phone
GPS
Telecom
Semiconductor
Automotive
Military
Medical
Instrumentation
Note book computers
IC Carrier board
Healthcare
FAQs for Hitech Circuits on HDI PCBs
1. What types of HDI PCBs are available at Hitech Circuits?
Hitech Circuits offers a range of HDI PCBs, including those with through vias from surface to surface, with buried vias and through vias, sequential lamination with various materials, and with passive substrate constructions having no electrical connection. Each type caters to specific design and performance requirements.

2. Can Hitech Circuits accommodate custom HDI PCB designs?
Absolutely! Hitech Circuits specializes in custom HDI PCB designs tailored to meet unique project requirements. Our team works closely with clients to understand their needs and deliver high-quality, precise PCBs that fit their specifications.

3. What materials are used in the manufacturing of HDI PCBs?
HDI PCBs at Hi-Tech Circuits are made from various high-quality materials, including FR-4, high-frequency materials (such as Rogers and Taconic), and flex and rigid-flex materials. Material selection depends on the application’s requirements, such as thermal management, electrical performance, and mechanical durability.

4. How does Hitech Circuits ensure the quality of their HDI PCBs?
Quality assurance is paramount at Hitech Circuits. We employ stringent quality control processes at every manufacturing stage, from design and material selection to fabrication and testing. Our HDI PCBs undergo multiple quality checks, including electrical testing, visual inspection, and automated optical inspection (AOI) to ensure they meet the highest standards.

5. What are the lead times for HDI PCB production?
Lead times for HDI PCB production can vary based on the complexity of the design and the quantity required. Generally, prototype orders can be completed within a few days to two weeks, while larger production orders may take several weeks. We strive to meet our clients’ deadlines and can provide more specific timeframes upon order placement.

6. Are there any design guidelines for HDI PCBs I should follow?
Yes, Hitech Circuits provides detailed design guidelines for HDI PCBs, which include recommendations on trace width, spacing, via sizes, and layer stacking. These guidelines help ensure the manufacturability of your design and optimize performance. Our team is also available to assist with any design questions.

7. Can Hitech Circuits support high-volume HDI PCB orders?
Certainly! Hitech Circuits is equipped to handle high-volume orders with the same attention to detail and quality assurance as smaller orders. We have the capacity and expertise to meet the demands of large-scale production runs efficiently.

8. How can I get a quote for my HDI PCB project?
Getting a quote is easy! Visit our website, and fill out the quote request form with your project details, such as PCB specifications, quantity, and any special requirements. Our sales team will review your information and provide you with a detailed quote promptly.

If you need any PCBA pls contact Sandy at sales9PCB Manufacturer PCB Assembly.com
https://hitechcircuits.com/pcb....-products/high-densi

Bergquist Aluminum PCB

Bergquist Aluminum pcb board manufactured by Hitech, the Thermal Clad circuit board materials are available from The Bergquist Company in four different thermal conductivities, High Power Lighting (HPL), High Temperature (HT), Low Modulus (LM) and Multi-Purpose (MP). If you are looking are Bergquist Aluminum based pcb manufacturer in China, please contact sales9Hitech Circuits Co Limited.com
Technical Parameters
Bergquist aluminum pcb
Base Material: Bergquist material Aluminum pcb
Layers: 1
Thickness: 1.5mm
Copper thickness: 1Oz
plating process: Immersion gold
Description: LED MPCB
What’s Bergquist Aluminium PCB?
Bergquist is one of USA company, which produce Aluminium base material sheet, the performance is perfect, Aluminium base material sheet is widely used for led PCB power industry.

Now that Power LEDs are capable of unprecedented levels of white LED brightness and luminous efficacy, they are being used in many products that are part of our daily lives. Although today the initial cost of Power LEDs is higher, many applications have demonstrated LED PCB lighting as the most cost or energy efficient solution for future installations. Bergquist provides critical thermal management support for a myriad of Power LED applications that include: medical, signage, signal, transportation, aircraft, automotive, security, portable, theatrical, commercial, residential and street lighting Power LED packaging has evolved to adapt to higher power dissipation demands. For these Power LED packages, the lowest possible thermal resistance packaging is paramount to a long and reliable service life. By combining Bergquist thermal management materials with this new and innovative packaging, progress in both light output and light quality can be achieved.

Printed Circuit Board Comparison

Metal core PCB and standard FR-4 are commonly used circuit board materials in conjunction with Power LEDs. Bergquist’s Thermal Clad dielectric is a thin, thermally conductive layer bonded to an aluminum or copper substrate for heat dissipation (see illustration below). The key to Thermal Clad’s superior performance lies in its dielectric layer. This layer offers electrical isolation with high thermal conductivity and bonds the base metal and circuit foil together. Other manufacturers use standard prepreg as the dielectric layer, but prepreg doesn’t provide the high thermal conductivity and resulting thermal performance required to help assure the lowest possible operating temperatures and brightest light output for high-intensity LEDs PCB. Thermal Clad circuit board materials are available from The Bergquist Company in four different thermal conductivities, High Power Lighting (HPL), High Temperature (HT), Low Modulus (LM) and Multi-Purpose (MP).

Packaging Conclusion

Good practice suggests that you reduce the thermal resistance of that layer with Thermal Clad dielectric instead of FR-4

Bergquist Aluminium PCB materials types:

Bergquist MP-06503

Bergquist HT04503

Bergquist HT07006

Bergquist HPL-03015

Bergquist HR T30.20

If you want to get Bergquist materials date sheet, please email to us, sales9PCB Manufacturer PCB Assembly.com

Or you can review Bergquist website: www.bergquistcompany.com

What is ceramic pcb board
Ceramic pcb boards are actually made of electronic ceramics as the basic material and can be made in various shapes. Among them, the characteristics of high temperature resistance and high electrical insulation of ceramic circuit boards are the most prominent. The advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to components are also very significant.

Different types of ceramic pcb
Ceramic PCB is widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules due to its excellent thermal conductivity and air tightness. But not everyone is clear about the classification. Many manufacturers think ceramic PCBs are expensive and fragile as soon as they hear about ceramic PCBs. Yes, this is indeed a shortcoming of ceramic PCBs, but not all ceramic PCBs are like this. Today we will tell you about the different types of ceramic PCBs.

Al2O3 ceramic PCB
Al2O3 ceramic PCB ( alumina ceramic PC refers to various ceramic PCBs with Al2O3 as the main raw material and an Al2O3 content of more than 75%. It has a rich source of raw materials, with advantages of low price, high mechanical strength and hardness, good insulation performance, good heat shock resistance, good chemical resistance, high dimensional accuracy, and good adhesion to metals. It is a ceramic substrate material with good comprehensive performance. Currently used Al2O3 ceramic substrates, the content of Al2O3 accounts for 85% to 99.5%. Among them, 96% Al2O3 ceramic PCB is widely used in the production of thick film circuit substrates and chip devices. The thermal conductivity of Al2O3 at room temperature is 29W/(m·K), which is close to the thermal conductivity of steel; with the increase of Al2O3 content, the electrical insulation performance and thermal conductivity of Al2O3 ceramic PCB will increase, but At the same time, it will also lead to an increase in the firing temperature, an increase in energy consumption, a large loss of kiln furniture, and an increase in manufacturing costs.

SiC ceramic PCB
The thermal conductivity of SiC ceramic PCB is very high, 100～490W/(m·K) at room temperature, and it is related to the purity of SiC crystals. The higher the purity, the greater the thermal conductivity; the oxidation resistance is good, and the decomposition temperature is above 2500℃, it can still be used at 1600℃ in an oxidizing atmosphere; the coefficient of thermal expansion is also low, and it is close to Si, with good electrical insulation performance; SiC has a Mohs hardness of 9.75, second only to diamond and cubic BN, and has high mechanical strength. SiC ceramics have strong covalent bond characteristics and are difficult to sinter. Usually, a small amount of boron or aluminum oxide is added as a sintering aid to increase the density. Experiments show that beryllium, boron, aluminum and their compounds are the most effective additives, which can make SiC ceramics denser than 98%.

BeO ceramic PCB
BeO has a brazine structure, in which oxygen ions are arranged in a hexagonal close-packed manner to form a hexagonal lattice. The general oxide is usually an ionic compound, but BeO has a strong covalent bond and an average molecular weight of only 12. Because of its good electrical properties, luminescence and photochemical properties, high mechanical strength, low dielectric loss, etc, it become one of the materials that people pay attention to.

AlN ceramic PCB
AlN ceramic PCB (aluminum nitride ceramic) is a new type of high thermal conductivity ceramic packaging material. It has been extensively studied in the 1990s and gradually developed. It is currently generally considered to be a promising electronic ceramic packaging PCB. AlN material has high thermal conductivity, excellent dielectric properties, high electrical insulation strength, stable chemical properties, strong corrosion resistance, and good mechanical properties. In particular, its thermal expansion coefficient matches with silicon, which makes it an ideal semiconductor packaging substrate materials and have been widely used in integrated circuits, microwave power devices, millimeter-wave packaging, high-temperature electronic packaging and other fields.

Ceramic PCB for IGBT Module
IGBT stands for insulated-gate bipolar transistor. It is a bipolar transistor with an insulated gate terminal. The IGBT combines, in a single device, a control input with a MOS structure and a bipolar power transistor that acts as an output switch. IGBTs Ceramic PCB are suitable for high-voltage, high-current applications. They are designed to drive high-power applications with a low-power input.

IGBT, or Insulated Gate Bipolar Transistor, is a BJT transistor with a MOS Gate, or we can say an IGBT module is the combination of a BJT and a MOS Gate. An IGBT chip is small in size, but it can control electrical energy transmission and achieve 100,000 times of current switch at ultra-high voltages of 650 million V in only 1 second.

IGBT modules have been applied in automotive, industrial, aerospace, consumer electronics, and many other industries for many years. But how to optimize the thermal dissipation of an IGBT package so the module can work at a higher power? If thermal can dissipate more quickly, the IGBT module can have more advanced applications. For this purpose, engineers are using ceramic PCBs for IGBT packaging.

Ceramic PCBs dissipate thermal from IGBT chip to the outer packaging

You may ask, how much thermal does an IGBT module generate when it works? It is equal to the heat generated by 100 electric furnaces. So much thermal has to be dissipated immediately from the IGBT chip and leads to the application of ceramic PCBs.

How does a ceramic PCB protect the IGBT module from the heat? In an IGBT module, a ceramic PCB is placed under the IGBT chip, or we can say that the chip is assembled on the ceramic circuit board. The ceramic PCB connects and supports the chip and dissipates thermal quickly from it to the outer packaging. In this way, the chip is protected from the influence of thermal.

Why Ceramic PCBs can be used for IGBT thermal dissipation

There are alumina (Al₂O₃) PCBs, aluminum nitride (AlN) PCBs, and silicon nitride (Si₃N₄) PCBs used for thermal dissipation of IGBT modules.

Why ceramic PCBs can dissipate thermal effectively for the IGBT module? Because ceramic materials have good properties of thermal dissipation and electrical insulation. Unlike aluminum substrate PCBs, ceramic PCBs do not use an insulation layer that hinders thermal dissipation. During the ceramic PCB manufacturing process, the copper-clad is directly bonded onto the ceramic substrate at high temperatures under high pressures. Then the circuit layer is manufactured by the photoresist coating method. When the circuit board is manufactured, the IGBT and other components are mounted on the board. Ceramic materials have ultra-high insulation and can withstand breakdown voltage up to 20KV/mm. The thermal conductivity of alumina PCBs is 15-35W/mK, aluminum nitride PCB 170-230W/mK, and silicon nitride PCB 80+W/mK. On the contrary, an aluminum PCB has thermal dissipation of only 1-12W/mK.

you’re interested in our products, pls kindly email to Sandy: sales9PCB Manufacturer PCB Assembly.com
https://hitechcircuits.com/pcb....-products/ceramic-pc