HDI is the abbreviation of High Density Interconnection, which is a kind of technology for the production of printed circuit boards. High density interconnection PCB board is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.
HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.
HDI pcb board is a compact product designed for small-capacity users.
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